Three-dimensional multi-physical modelling of the influence of the cutting fluid on the chip formation process

Liu, Hui (Corresponding author); Peng, Bingxiao; Meurer, Markus Joachim; Schraknepper, Daniel; Bergs, Thomas

Amsterdam [u.a.] : Elsevier (2021)
Contribution to a conference proceedings, Journal Article

In: Procedia CIRP
Volume: 102
Page(s)/Article-Nr.: 216-221