Punch-to-Punch Variations in Stamping Processes

Piscataway, NJ] / IEEE (2020) [Contribution to a book, Contribution to a conference proceedings]

SAMI 2020 : IEEE 18th World Symposium on Applied Machine Intelligence and Informatics : proceedings : January 23-25, 2020, Herl’any, Slovakia / organizers: Technical University of Košice (Slovakia), Óbuda University (Budapest, Hungary), University Research and Innovation Center, Antal Bejczy Center for Intelligent Robotics, ELFA Ltd. (Košice, Slovakia), Slovak Academy of Sciences, SMC TC on Computational Cybernetics, IEEE Computational Intelligence Chapter of Czechoslovak Section ; sponsors: IEEE Hungary Section, IEEE Joint Chapter of IES and RAS Hungary, IEEE Control Systems Chapter Hungary, IEEE SMC Chapter Hungary ; technical co-sponsor: IEEE SMC Society ; publisher: IEEE .2020.9108761
Page(s): 000213-000218



Bergs, Thomas
Niemietz, Philipp
Kaufman, Tobias
Trauth, Daniel